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Thermaltake TG-30 Thermal Compound

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Product details

Management number 241241682 Release Date 2026/07/17 List Price US$4.00 Model Number 241241682
Category
Overview

The Thermaltake CL-O023-GROSGM-A is a thermal compound designed to improve heat dissipation from your CPU, ensuring stable and efficient cooling. Featuring a diamond powder formula with a thermal conductivity of 4.5 W/m-k, it supports both air and liquid cooling solutions by enhancing thermal transfer. This compound is ideal for gamers, content creators, and everyday users who want to maintain optimal processor temperatures during demanding tasks.

Key features
  • Diamond powder formulation that enhances thermal conductivity for better heat transfer
  • Includes a honeycomb stencil to help apply the compound evenly and cleanly without mess
  • Comes with application tools that simplify spreading the paste uniformly over the CPU surface
  • Compound resists drying out and cracking, maintaining consistent performance over time
  • Non-electrically conductive formula reduces risk of short circuits during installation
  • Suitable for multiple system upgrades and long-term use without degradation
Key specs
  • Thermal conductivity: 4.5 W/m-k
  • Formula: diamond powder-based thermal compound
  • Application method: honeycomb stencil and included spreading tools
  • Electrical conductivity: non-electrically conductive
Installation and setup

Applying the TG-30 thermal compound is straightforward thanks to the included honeycomb stencil, which ensures a uniform layer of paste on the CPU surface. This eliminates guesswork and prevents uneven application that can reduce cooling efficiency. The all-in-one kit provides everything needed for a clean and precise installation, making it accessible for both first-time builders and experienced technicians.

Ideal uses and environments

This thermal compound works well in gaming rigs, creative workstations, and general-purpose PCs where maintaining low CPU temperatures is critical. It supports overclocking efforts by improving heat transfer, helping users push their processors safely. The long-lasting formula also makes it a strong choice for users who want reliable cooling performance through multiple system upgrades or extended periods of continuous use.


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